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dc.date.accessioned 2022-10-27T16:42:28Z
dc.date.available 2022-10-27T16:42:28Z
dc.date.issued 1997
dc.identifier.uri http://sedici.unlp.edu.ar/handle/10915/144664
dc.description.abstract The influence of O₃ on the passive behaviour of copper was analysed in the potential region -0.32 to 0.70 V vs RHE in borax solutions (pH 9.2) through voltammetric techniques and ellipsometry. Oxide formation can be explained as a sequence of Cu₂O growth, Cu(II) chemisorption, and dissolution precipitation steps similar to those corresponding to copper electrodes in deaerated solutions. The role of Cu(II) chemisorption is discussed in this paper. The progressive accumulation of hydrated layers hinders the reaction between O₃ and the metal. O₂ and O₃ promote growth and dissolution processes (both at open circuit and in controlled potential experiments) but O₃ has a stronger effect. en
dc.format.extent 396-403 es
dc.language es es
dc.subject Ozone es
dc.subject Oxide film es
dc.subject Chemisorption es
dc.subject Cu2O es
dc.subject Open circuit es
dc.title Electrochemical and ellipsometric study of the oxide films formed on copper in borax solution. Part II: Effect of ozone en
dc.type Articulo es
sedici.identifier.other doi:10.1023/A:1018405519170 es
sedici.identifier.issn 0021-891X es
sedici.identifier.issn 1572-8838 es
sedici.creator.person Fernández Lorenzo de Mele, Mónica Alicia es
sedici.creator.person Viera, Marisa Rosana es
sedici.creator.person Zerbino, Jorge Omar es
sedici.subject.materias Química es
sedici.description.fulltext true es
mods.originInfo.place Instituto de Investigaciones Fisicoquímicas Teóricas y Aplicadas es
sedici.subtype Articulo es
sedici.rights.license Creative Commons Attribution-NonCommercial-ShareAlike 4.0 International (CC BY-NC-SA 4.0)
sedici.rights.uri http://creativecommons.org/licenses/by-nc-sa/4.0/
sedici.description.peerReview peer-review es
sedici.workflowEdited true es
sedici.relation.journalTitle Journal of Applied Electrochemistry es
sedici.relation.journalVolumeAndIssue vol. 27, no. 4 es


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Creative Commons Attribution-NonCommercial-ShareAlike 4.0 International (CC BY-NC-SA 4.0) Except where otherwise noted, this item's license is described as Creative Commons Attribution-NonCommercial-ShareAlike 4.0 International (CC BY-NC-SA 4.0)