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dc.date.accessioned 2021-06-17T17:06:41Z
dc.date.available 2021-06-17T17:06:41Z
dc.date.issued 2020-11-13
dc.identifier.uri http://sedici.unlp.edu.ar/handle/10915/120473
dc.description.abstract Microorganisms grow on all kinds of materials, including metals, inorganic minerals and organic polymers under humid conditions. Complex community of microorganisms and their extracellular polysaccharides established as biofilm is a prerequisite for corrosion and/or deterioration of the underlying materials. This affects great-economic-value metallic structures like bridges and pipes; 70% of the corrosion in gas transmission lines are due to problems caused by microorganisms. Metallic structures are generally protected by anti-corrosion coatings, but biofilm over these coatings can lead to blistering and adhesion loss, causing failure of the protective system. Filamentous fungi are regarded as the micro-organisms that cause the most spoilage of paint films. en
dc.language en es
dc.subject Agentes de Control de Microorganismos es
dc.subject Corrosión es
dc.subject Pinturas es
dc.title Fungal deterioration of anti-corrosive coatings en
dc.type Articulo es
sedici.identifier.uri https://www.pcimag.com/articles/108108-fungal-deterioration-of-anti-corrosive-coatings es
sedici.identifier.issn 0253-4312 es
sedici.title.subtitle Assessment by Electrochemical Techniques and Scanning Electron Microscopy en
sedici.creator.person Roselli, Sol Natacha es
sedici.creator.person Deyá, Marta Cecilia es
sedici.creator.person Bellotti, Natalia es
sedici.subject.materias Química es
sedici.description.fulltext true es
mods.originInfo.place Centro de Investigación y Desarrollo en Tecnología de Pinturas es
sedici.subtype Preprint es
sedici.rights.license Creative Commons Attribution-NonCommercial-ShareAlike 4.0 International (CC BY-NC-SA 4.0)
sedici.rights.uri http://creativecommons.org/licenses/by-nc-sa/4.0/
sedici.relation.journalTitle Paint & Coating Industry es


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Creative Commons Attribution-NonCommercial-ShareAlike 4.0 International (CC BY-NC-SA 4.0) Excepto donde se diga explícitamente, este item se publica bajo la siguiente licencia Creative Commons Attribution-NonCommercial-ShareAlike 4.0 International (CC BY-NC-SA 4.0)