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dc.date.accessioned 2021-07-08T16:11:30Z
dc.date.available 2021-07-08T16:11:30Z
dc.date.issued 1964
dc.identifier.uri http://sedici.unlp.edu.ar/handle/10915/121420
dc.description.abstract Ionic mass transfer for the electrodeposition of copper from aqueous copper sulphate-sulphuric acid solutions has been studied on tubular stainless steel electrodes. The following parameters were varied: rate of flow, copper ion concentration, viscosity, height and diameter of tubular electrodes, and temperature. The data can be correlated by the dimensionless equation Sh = 0·647 Re1/2Sc1/3. The temperature coefficient of the kinetic mass-transfer constant is 1.2, corresponding to an experimental heat of activation of 3850 ± 200 cal/mol. The solution of the momentum- and heat-transfer equations worked out by Eckert for flat plates, according to von Kármán's treatment, and recently extended by Wranglén to the analogous masstransfer problem, can be applied under certain conditions to tubular electrodes. en
dc.format.extent 17-30 es
dc.language en es
dc.subject Ionic mass transfer es
dc.subject Copper es
dc.subject Electrodeposition es
dc.title Ionic mass transfer in the electrolysis of flowing solutions en
dc.type Articulo es
sedici.identifier.other https://doi.org/10.1016/0013-4686(64)80002-5 es
sedici.identifier.issn 0013-4686 es
sedici.title.subtitle The electrodeposition of copper under mass-transfer control on tubular electrodes en
sedici.creator.person Bazán, Julio César es
sedici.creator.person Arvia, Alejandro Jorge es
sedici.subject.materias Ciencias Exactas es
sedici.subject.materias Química es
sedici.description.fulltext true es
mods.originInfo.place Instituto de Investigaciones Fisicoquímicas Teóricas y Aplicadas es
sedici.subtype Articulo es
sedici.rights.license Creative Commons Attribution 4.0 International (CC BY 4.0)
sedici.rights.uri http://creativecommons.org/licenses/by/4.0/
sedici.description.peerReview peer-review es
sedici.relation.journalTitle Electrochimica Acta es
sedici.relation.journalVolumeAndIssue vol. 9, no. 1 es


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Creative Commons Attribution 4.0 International (CC BY 4.0) Excepto donde se diga explícitamente, este item se publica bajo la siguiente licencia Creative Commons Attribution 4.0 International (CC BY 4.0)