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dc.date.accessioned 2012-11-15T15:14:43Z
dc.date.available 2012-11-15T15:14:43Z
dc.date.issued 2006-08
dc.identifier.uri http://sedici.unlp.edu.ar/handle/10915/24235
dc.description.abstract Some of the artificial intelligence (AI) methods could be used to improve the performance of automation systems in manufacturing processes. However, the application of these methods in the industry is not widespread because of the high cost of the experiments with the AI systems applied to the conventional manufacturing systems. To reduce the cost of such experiments, we have developed a special micromechanical equipment, similar to conventional mechanical equipment, but of a lot smaller overall sizes and therefore of lower cost. This equipment can be used for evaluation of different AI methods in an easy and inexpensive way. The methods that show good results can be transferred to the industry through appropriate scaling. This paper contains brief description of low cost microequipment prototypes and some AI methods that can be evaluated with mentioned prototypes. en
dc.language en es
dc.subject Equipment es
dc.subject Inteligencia Artificial es
dc.subject Automation es
dc.subject Industrial automation es
dc.title Micromechanics as a testbed for artificial intelligence methods evaluation en
dc.type Objeto de conferencia es
sedici.identifier.isbn 0-387-34655-4 es
sedici.creator.person Kussul, Ernst es
sedici.creator.person Baidyk, Tatiana es
sedici.creator.person Lara Rosano, Felipe es
sedici.creator.person Makeyev, Oleksandr es
sedici.creator.person Martín, Anabel es
sedici.creator.person Wunsch, Donald es
sedici.description.note Applications in Artificial Intelligence - Applications es
sedici.subject.materias Ciencias Informáticas es
sedici.description.fulltext true es
mods.originInfo.place Red de Universidades con Carreras en Informática (RedUNCI) es
sedici.subtype Objeto de conferencia es
sedici.rights.license Creative Commons Attribution-NonCommercial-ShareAlike 2.5 Argentina (CC BY-NC-SA 2.5)
sedici.rights.uri http://creativecommons.org/licenses/by-nc-sa/2.5/ar/
sedici.date.exposure 2006-08
sedici.relation.event 19 th IFIP World Computer Congress - WCC 2006 es
sedici.description.peerReview peer-review es


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Creative Commons Attribution-NonCommercial-ShareAlike 2.5 Argentina (CC BY-NC-SA 2.5) Excepto donde se diga explícitamente, este item se publica bajo la siguiente licencia Creative Commons Attribution-NonCommercial-ShareAlike 2.5 Argentina (CC BY-NC-SA 2.5)