Subir material

Suba sus trabajos a SEDICI, para mejorar notoriamente su visibilidad e impacto

 

Mostrar el registro sencillo del ítem

dc.date.accessioned 2019-02-27T11:27:26Z
dc.date.available 2019-02-27T11:27:26Z
dc.date.issued 2016-01-10
dc.identifier.uri http://sedici.unlp.edu.ar/handle/10915/72666
dc.description.abstract Table of contents: -University of South Florida: I+D+E -To share knowledge from Engineering Disciplines and tools designed to help us solve Complex Trans/Multi/Inter- disciplinary engineering challenges -To share on-going efforts in I+D+E at the College of Engineering/Department of Electrical Engineering at USF -To Emphasize the Importance of Creating Vehicles of Interaction Between Academia, Industry, Funding Agencies and Government and the impact of the ISTEC network en
dc.language es es
dc.subject Investigación es
dc.subject Sistemas Complejos es
dc.subject Educación es
dc.subject SCED-ISTEC es
dc.subject Innovación es
dc.subject Ibero-American Science and Technology Education Consortium (ISTEC) es
dc.title R+D+E Management & Innovation from the Complex Systems Perspective en
dc.type Objeto de conferencia es
sedici.creator.person Moreno, Wilfrido es
sedici.creator.person Cruz Quiroga, Luis Fernando es
sedici.subject.materias Ciencias de la Educación es
sedici.subject.materias Ingeniería es
sedici.description.fulltext true es
mods.originInfo.place Ibero-American Science and Technology Education Consortium es
sedici.subtype Objeto de conferencia es
sedici.rights.license Creative Commons Attribution-NoDerivatives 4.0 International (CC BY-ND 4.0)
sedici.rights.uri http://creativecommons.org/licenses/by-nd/4.0/
sedici.date.exposure 2016-10-10
sedici.relation.event Research, Development & Education (R+D+E): Management and Innovation Required for the XXI Century (Tampa, 2016) es


Descargar archivos

Thumbnail
Presentación (45 diap.)
Descargar archivo (2.924Mb) - PDF

Este ítem aparece en la(s) siguiente(s) colección(ones)

Creative Commons Attribution-NoDerivatives 4.0 International (CC BY-ND 4.0) Excepto donde se diga explícitamente, este item se publica bajo la siguiente licencia Creative Commons Attribution-NoDerivatives 4.0 International (CC BY-ND 4.0)