In this work we discuss pattern-preserving growth during metal deposition from the vapor on micro/nano-structured metal substrates. Experimental results for Cu deposition on patterned Cu substrates show pattern preserving growth or pattern destruction depending on the incident angle. We introduce a mesoscopic 1+1 dimensional model including deposition flow (directed and isotropic), surface diffusion and shadowing effects that account for the experimental growth data. Moreover, simulations on post-deposition annealing, for high aspect-ratio patterns show departures from the predictions of the linear theory for surface diffusion.