Validity of the linear growth equation for interface evolution for copper electrodeposition in the presence of organic additives

Abstract

The interface evolution of copper electrodeposits produced on copper from a thiorea-derivative-containing acid plating bath at a low current density and 298 K was studied by atomic force microscopy (AFM). The dynamic scaling theory was applied to AFM images leading to scaling exponents, which are consistent with the predictions of the complete linear equation for interface growth. In agreement with the theory, experimental data show, for the interface evolution, a crossover from a surface diffusion controlled regime to an Edwards-Wilkinson regime as the length scale increases.